ALL CATEGORIES8-XQFN
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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Dual low-ohmic single-pole single-throw analog switch
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Single D-type flip-flop with set and reset; positive edge trigger
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1662
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Low-power D-type flip-flop with set and reset; positive-edge trigger
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16199
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Q:What defines the physical structure of 8-XQFN?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 8-pin layout with dual-row perimeter arrangement.
- 0.6 mm ultra-thin profile for space-constrained designs. -
Q:Why choose 8-XQFN over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOIC-8.
- Thermal Performance: Direct PCB heat path via exposed pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency apps.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0×2.0 mm.
- Height: 0.6 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is 8-XQFN typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2541).
- Sensor Interfaces: MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine pitch.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad alignment.