8-VFSOP (0.091, 2.30mm Width)
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- Description
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- Quantity
- Operation
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Flip Flop D-Type Pos-Edge 1-Element 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5750
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Buffer/Line Driver 2-CH Non-Inverting 3-ST CMOS 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9782
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Voltage Level Translator 2-CH Unidirectional 8-Pin SSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5393
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Voltage Level Translator 2-CH Unidirectional 8-Pin US T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2950
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Inverter 3-Element CMOS Automotive 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Multiplexer 1-Element CMOS 2-IN Automotive 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Inverter Schmitt Trigger 3-Element CMOS Automotive 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
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AND Gate 2-Element 2-IN CMOS Automotive 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2940
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Inverter 3-Element CMOS Automotive 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5088
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Flip Flop D-Type Pos-Edge 1-Element 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 135
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Inverter Schmitt Trigger 3-Element CMOS 8-Pin SSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7720
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2-Bit, 2-Supply, Bus Transceiver with Configurable Level-Shifting and Translation and 3-State Outputs
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1 + 10 + 25 + 50 + >=100 -
1
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NAND Gate 2-Element 2-IN CMOS Automotive 8-Pin US T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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EEPROM Serial-I2C 64K-bit 256Pages x 32 1.8V/2.5V/3.3V/5V Automotive 8-Pin US T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Monostable Multivibrator, 74LVC1G123, 50 mA, 1.65 V to 5.5 V, VSSOP-8
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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EEPROM Serial-I2C 2K-bit 16Pages x 128 1.8V/2.5V/3.3V/5V 8-Pin US T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3074
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Translation - Voltage Levels Automotive Dual-Channel Bidirectional Multi-Voltage Level Translator 8-VSSOP -40 to 125
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1 + 10 + 25 + 50 + >=100 -
1
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1-ohm SPDT ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER,Analog Switch ICs 1O SPDT Ana Sw
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1 + 10 + 25 + 50 + >=100 -
1
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Dual-Bit Dual-Supply Bus Transceiver with Configurable Voltage Translation and 3-State Outputs 8-US8 -40 to 85,Translation - Voltage Levels DualB Dual Supply Bus Trancvr
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1 + 10 + 25 + 50 + >=100 -
1
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Translation - Voltage Levels Dual bdrctnl I2C-bus & vltg-lvl trnsltr
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Translation - Voltage Levels DUAL I2C/SMBUS VOLT TRANSL
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 54000
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Dual SPST Analog Switch,Analog Switch ICs DUAL SPST ANLOG SWCH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15700
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DPST Analog Switch,Analog Switch ICs DPST ANALOG SWITCH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60000
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2-Bit LVTTL/GTLP Transceiver,Bus Transceivers 2Bit LVTTL/GTLP Xcvr
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1040
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1-Bit LVTTL/GTLP Transceiver with Separate LVTTL Port and Feedback Path,Bus Transceivers 1Bit LVTTL/GTLP Xcvr
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Logic Gates TRIPLE-GATES - AUTOMOTIVE CATALOG TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
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1 + 10 + 25 + 50 + >=100 -
1
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Buffer/Driver 3CH Non-Inverting Open Drain CMOS Automotive 8Pin VSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Flip Flop D-Type Pos-Edge 1-Element Automotive 8-Pin VSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Multiplexer Switch ICs 74LVC1G53DC-Q100/VSSOP8/REEL 7
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Analog Switch ICs Analog SW Dual SPST 5.5V 8-Pin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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Schmitt Trigger Buffer 3CH Non-Inverting CMOS 8Pin VSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Q:What defines the physical structure of 8-VFSOP?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 8-pin layout with dual-row configuration: Optimizes space efficiency.
- 0.91mm (0.091") ultra-thin profile: Ideal for low-profile designs. -
Q:Why choose 8-VFSOP over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than standard SOIC-8.
- Thermal Performance: Direct PCB heat path via central pad.
- Electrical Benefits: Low-inductance design for high-frequency applications.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.30mm × 3.00mm (width × length).
- Height: 0.91mm (0.091").
- Pin Pitch: 0.50mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C. -
Q:Where is 8-VFSOP typically applied?
A:Dominant use cases:
- Portable Electronics: Power management ICs (e.g., TPS62743).
- RF Modules: Bluetooth/WiFi transceivers (e.g., CC2541).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use thermal vias under the central pad.
- Solder Paste: Type 4 solder recommended for fine-pitch.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad alignment verification.



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