780-BBGA, FCBGA
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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QorIQ, 32-Bit Power Arch SoC, 4 X 1.5GHz, DDR3/3L, PCIe, SATA, SRIO, 1/10GbE, 0 to 105C, Rev 2
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5
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MPU C29x Crypto RISC 32Bit 1200MHz 3.3V 780Pin FCP-BGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 507
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FPGA Arria? II GX Family 60214 Cells 500MHz 40nm Technology 0.9V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 294
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FPGA Arria? II GX Family 60214 Cells 400MHz 40nm Technology 0.9V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 685
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FPGA Arria II GX Family 42959 Cells 500MHz 40nm Technology 0.9V 780Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 207
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FPGA Arria? II GX Family 42959 Cells 400MHz 40nm Technology 0.9V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 658
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FPGA Arria? II GX Family 244188 Cells 500MHz 40nm Technology 0.9V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 789
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FPGA Arria? II GX Family 244188 Cells 400MHz 40nm Technology 0.9V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 313
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FPGA Arria? II GX Family 181165 Cells 500MHz 40nm Technology 0.9V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 618
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FPGA Arria? II GX Family 118143 Cells 400MHz 40nm Technology 0.9V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 652
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FPGA Arria? II GX Family 118143 Cells 500MHz 40nm Technology 0.9V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 32
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FPGA Mercury Family 350K Gates 14400 Cells 1.8V 780-Pin FC-FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 717
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FPGA Arria 10 GX 480000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 579
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FPGA Arria 10 GX 480000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 753
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FPGA Arria? 10 GX Family 480000 Cells 20nm Technology 0.9V 780-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 152
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FPGA Arria? 10 GX Family 480000 Cells 20nm Technology 0.9V 780-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 955
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FPGA Arria? 10 GX Family 320000 Cells 20nm Technology 0.9V 780-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 982
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FPGA Arria 10 GX 320000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 343
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FPGA Arria? 10 GX Family 320000 Cells 20nm Technology 0.9V 780-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 225
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FPGA Arria 10 GX 320000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 503
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FPGA Arria 10 GX 270000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 105
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FPGA Arria 10 GX 270000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 149
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FPGA Arria 10 GX 270000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 51
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FPGA Arria 10 GX 270000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 438
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FPGA Arria 10 GX 220000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 64
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FPGA Arria 10 GX 220000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 713
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FPGA Arria? 10 GX Family 160000 Cells 20nm Technology 0.9V 780-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 54
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FPGA Arria 10 GX 160000 Cells 20nm Technology 0.9V 780Pin F-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 571
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FPGA Arria 10 SX Family 480000 Cells 20nm Technology 0.9V Medical 780Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 745
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Q:What defines the physical structure of 780-BBGA, FCBGA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 780-pin layout with staggered arrangement: Optimizes signal routing density.
- 1.2 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose 780-BBGA, FCBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than traditional BGA packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 15×15 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy leads with solder mask coating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 780-BBGA, FCBGA typically applied?
A:Dominant use cases:
- Power Converters: High-current ICs (e.g., TI TPS65988).
- RF Modules: 5G mmWave transceivers (e.g., Qualcomm QPM5679).
- Sensor Interfaces: MEMS arrays (e.g., Bosch BMI323). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (5–15 μm particle size).
- Reflow Profile: Peak temp ≤ 245°C (ramp rate 2°C/sec).
- Inspection: X-ray (AXI) mandatory for void detection (<10% tolerance).



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