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6-UFDFN
6-UFDFN
The 6-UFDFN (6-Pin Ultra-Thin Dual Flat No-Lead) is a surface-mount package designed for high-density circuits. Featuring a leadless design, exposed thermal pad, and ultra-thin profile, it delivers superior heat dissipation, reduced signal interference, and space-saving integration. Typical dimensions are 2.0×2.0 mm with a 0.5 mm pin pitch and 0.6 mm height, making it ideal for power management ICs in portable devices, wearable electronics, and IoT modules. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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TVS DIODE 3.3VWM 9VC 6UDFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9513
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TVS DIODE 5VWM 16VC 6UDFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5639
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TVS DIODE 5.5VWM 12V U-DFN1610-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9420
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IC PLL PROG CLOCK DFN-6L
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 971
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Conv DC-DC 2.05V to 6V Synchronous Step Down Single-Out 1.2V 0.5A 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Processor Supervisor Adj/Adj 2 Active Low/Push-Pull 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Processor Supervisor Adj/Adj 2 Active Low/Push-Pull 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Processor Supervisor Adj/Adj 2 Active Low/Push-Pull 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Processor Supervisor Adj/Adj 2 Active Low/Push-Pull 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Supervisor, Active-Low, Open-Drain Reset, 1.65V-5.5Vin, UDFN-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2995
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OR Gate 1-Element 3-IN CMOS 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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AND Gate 1-Element 2-IN CMOS 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Buffer/Driver 1-CH Non-Inverting Open Drain CMOS 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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NAND Gate 1-Element 2-IN CMOS 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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NAND Gate 1-Element 2-IN CMOS 6-Pin USON T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Inverter Schmitt Trigger 2-Element CMOS 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24000
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Inverter Schmitt Trigger, CMOS, 2 inputs, 1.65 V to 5.5 V, UDFN-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10368
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Buffer/Driver 2-CH Inverting Open Drain CMOS 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24000
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Inverter 2-Element CMOS 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 27000
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Multi Function Gate 1-Element 2-IN CMOS 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 42000
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OR Gate, CMOS, 3 inputs, 25 mA, 1.65 V to 5.5 V, UDFN-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 35990
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Buffer 2-CH Non-Inverting CMOS Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Non-Inverting Buffer / CMOS Logic Level Shifter
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Voltage Level Translator 1-CH Unidirectional Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 36000
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Buffer 2-CH Non-Inverting CMOS Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30000
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Inverter 2-Element CMOS Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 114000
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Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 66000
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Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2907
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Inverter 1-Element CMOS 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 75000
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OR Gate 1-Element 2-IN CMOS Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 54000
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Voltage Level Translator, 1 Input, 40 ns, 900 mV to 4.5 V, UDFN-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Analogue Comparator, Rail to Rail, Low Voltage, 1 Comparator, 580 ns, 850mV to 6V, µDFN, 6 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8358
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Translator 2-CH Unidirectional 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
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LDO Regulator Pos 3V 0.15A 6-Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2953
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LDO Regulator Pos 2.8V 0.15A 6-Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3086
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LDO Regulator Pos 2.5V 0.15A 6-Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2833
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LDO Regulator Pos 1.8V 0.15A 6-Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1600
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LDO Regulator Pos 1V 0.15A 6-Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1100
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Conv DC-DC 2.7V to 6V Synchronous Step Down Single-Out 3.3V 0.5A 6-Pin UTDFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Power Load Switch, High Side, Active High, 1 Output, 0.05 ohm On State, 5.5 V supp, 3 A, UDFN-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9000
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IC REG BUCK 1.2V 0.6A SYNC USP-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3033
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RF Switch SPDT 100MHz to 6GHz 33dB 6-Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8409
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MOSFET 2N-CH 20V 7.5A UDFN2030-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
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Multi Function Gate 1-Element 4-IN CMOS 8-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 57000
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OTHER CLOCK GENERATOR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1282
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LDO Voltage Regulators 150mA Low Noise Hi 1.5V 6.3uVRMS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3630
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Analog Switch ICs Low voltage 1 ohm single-pole double-throw analog switch with break-before-make feature
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5441
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IC REG BUCK SYNC 1V 1.5A 6-USP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4522
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ESD Suppressor Diode Array Uni-Dir 5V Automotive 6-Pin UDFN T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 866
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Q:What defines the physical structure of 6-UFDFN?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 6-pin layout with dual-row arrangement: Optimizes space efficiency.
- 0.5 mm ultra-thin profile: Ideal for compact designs. -
Q:Why choose 6-UFDFN over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOIC-8.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency applications.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 1.5×1.0 mm
- Height: 0.5 mm
- Pin Pitch: 0.35 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is 6-UFDFN typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62743).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2640).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (4×4 array recommended).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (ramp rate 2°C/sec).
- Inspection: X-ray (AXI) mandatory for void detection.