ALL CATEGORIES6-UDFN Exposed Pad
- Picture & Models
- Description
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- Quantity
- Operation
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MOSFET N-CH 60V 3A DFN2020MD-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9360
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MOSFET P-CH 20V 3.2A 6DFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6496
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MOSFET 2N-CH 30V 9.1A 6UDFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5291
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MOSFET 2N-CH 12V 5.6A 6UDFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5282
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MOSFET N-CH 40V 8A DFN2020MD-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9761
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MOSFET N-CH 80V 3.2A/9.8A 6DFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9102
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MOSFET N-CH 60V 5A DFN2020MD-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7299
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IC BATT PROT LI-ION 1CELL 6UDFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9266
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IC BATT PROT LI-ION 1CELL 6UDFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9369
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IC REG LINEAR POS ADJ 600MA 6DFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5869
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IC PWR SWITCH P-CH 1:1 6DFN2020
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6374
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TRANS PNP/N CH 40V 1.8A 6HUSON
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30000
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Power MOSFET â20 V, â8.2 A, Single PâChannel,
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 11175
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P-Channel MOSFET, 6.2 A, 20 V, 6-Pin U-DFN2020 Diodes Inc
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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600mA, Low Quiescent Current, Fast Transient Low Dropout Linear Regulator
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1558
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Low Dropout Regulators - LDO 300mA LDO REG 35uA 2 to 6 Vin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1655
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Low Dropout Regulators - LDO LDO HiVolt LowCurr REGULATOR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
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Low Dropout Regulators - LDO 300mA LDO REG 35uA 2 to 6 Vin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Low Dropout Regulators - LDO 300mA LDO REG 35uA 2 to 6 Vin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5123
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300mA, Low Quiescent Current, Fast Transient Low Dropout Linear Regulator
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9000
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300mA, Low Quiescent Current, Fast Transient Low Dropout Linear Regulator
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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300mA, Low Quiescent Current, Fast Transient Low Dropout Linear Regulator
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT LOW DROPOUT LINEAR REGULATOR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT LOW DROPOUT LINEAR REGULATOR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT LOW DROPOUT LINEAR REGULATOR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10188
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LED Display Drivers 60V LINEAR 75mA ADJ CRNT LED DVR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Q:What defines the physical structure of 6-UDFN Exposed Pad?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 6-pin layout with dual-row arrangement: Optimizes space efficiency.
- 0.5 mm ultra-thin profile: Ideal for compact designs. -
Q:Why choose 6-UDFN Exposed Pad over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOIC-8.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant (MSL3) substrate for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 1.5 × 1.0 mm
- Height: 0.5 mm
- Pin Pitch: 0.35 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is 6-UDFN Exposed Pad typically applied?
A:Dominant use cases:
- Power Converters: e.g., DC-DC buck regulators (TPS62743).
- RF Modules: e.g., Bluetooth Low Energy transceivers (CC2640).
- Sensor Interfaces: e.g., MEMS accelerometers (BMA253). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under exposed pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad solder joint verification.