ALL CATEGORIES64-UFBGA, WLCSP
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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IC REG PMU 64WLCSP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 19
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IC REG PMU 64WLCSP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 17
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IC PMU CHARGER/BKLT DVR 56QFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 758
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IC PMU CHARGER/BKLT DVR 56QFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 47
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IC MCU 32BIT 1MB FLASH 64WLCSP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 234
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Kinetis K 32-bit MCU, ARM Cortex-M4 core, 256KB Flash, 120MHz, USB, WLCSP 64
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 684
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 256 KB, 64 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 187
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IC MCU 32BIT 128KB FLASH 64WLCSP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 560
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 256 KB, 64 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 128 KB, 64 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 164
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ARM MCU, ECOPACK®2, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 256 KB, 64 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 992
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IC MCU 32BIT 512KB FLASH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 247
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IC MCU 32BIT 256KB FLASH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 347
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ARM MCU, Access Line, STM32 Family STM32F0 Series Microcontrollers, ARM Cortex-M0, 32bit, 48 MHz
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 132
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FUSE CLIP CARTRIDGE 250V 10A PCB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 826
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IC MCU 32BIT 256KB FLASH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 493
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IC MCU 32BIT 256KB FLASH 64WLCSP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 138
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 160 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 146
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 256 KB, 64 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 513
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 160 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 168
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 128 KB, 64 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 559
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IC MCU 32BIT 256KB FLASH 64WLCSP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 525
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IC MCU 32BIT 512KB FLASH 64WLCSP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 217
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IC MCU 32BIT 1MB FLASH 64WLCSP
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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MCU 32-bit ARM Cortex M3 RISC 384KB Flash 1.8V/2.5V/3.3V 64-Pin WLCSP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2523
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MCU 32-bit ARM Cortex M4 RISC 512KB Flash 3.3V 64-Pin WLCSP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 55000
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 160 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100000
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MCU 32-bit ARM Cortex M3 RISC 256KB Flash 2.5V/3.3V 64-Pin WLCSP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 432
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ARM MCU, Ethernet MAC, Camera Interface, STM32 Family STM32F2 Series Microcontrollers
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 168
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Q:What defines the physical structure of 64-UFBGA (WLCSP)?
A:Key features include:
- Leadless bottom-mounted pads: Direct solder attachment to PCB for compact designs.
- Central thermal pad: 4×4 mm coverage for efficient heat dissipation.
- 64-pin layout: 8×8 array configuration with 0.5 mm pitch.
- Ultra-thin profile: 0.6 mm height for space-constrained applications. -
Q:Why choose 64-UFBGA (WLCSP) over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent QFN packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance (<0.5 nH) and short signal paths for high-frequency performance.
- Reliability: Moisture-resistant (MSL3) substrate and halogen-free materials. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm.
- Height: 0.6 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy pads with Ni/Pd/Au finish.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 64-UFBGA (WLCSP) typically applied?
A:Dominant use cases:
- Mobile Devices: PMICs (e.g., Qualcomm SMB1396).
- IoT Modules: Bluetooth/Wi-Fi SoCs (e.g., Nordic nRF5340).
- Automotive Sensors: MEMS interfaces (e.g., Bosch BMI270). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 4×4 thermal via array (0.3 mm diameter) under the central pad.
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).