ALL CATEGORIES63-UFBGA, WLCSP
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
-
-
USB-OTG 1.55 A LI-ION SWITCHING
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 987
-
-
SMART CODEC W DUAL CORE DSP FOR
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 280
-
-
ARM MCU, Ultra Low Power, STM32 Family STM32L1 Series Microcontrollers, ARM Cortex-M3, 32bit
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1470
-
-
32 Bit Microcontroller, ARM-Cortex-M3, 128KB Flash, 32KB SRAM, 4KB EEPROM, USB, ADC, DAC, UFQFPN-48
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 588
-
-
WLCSP 63L (7X9) DIE 427 P 0.4
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15000
-
-
Switching Battery Charger Li-Ion/Li-Pol 3200mA 63-Pin WLCSP T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 746
-
Q:What defines the physical structure of 63-UFBGA (WLCSP)?
A:Key features include:
- Leadless bottom-mounted pads: Direct solder attachment to PCB.
- Central thermal pad: ~60% substrate coverage for heat dissipation.
- 63-pin layout: Area-array configuration (e.g., 7×9 grid).
- Ultra-thin profile: 0.4 mm height for space-constrained designs. -
Q:Why choose 63-UFBGA (WLCSP) over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than QFN equivalents.
- Thermal Performance: Direct PCB heat path via thermal pad.
- Electrical Benefits: Low-inductance (<0.5 nH) and short signal paths.
- Reliability: Halogen-free substrate with moisture resistance (MSL3). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.2 × 2.5 mm.
- Height: 0.4 mm.
- Pin Pitch: 0.35 mm.
- Material: Copper-pillar bumps with solder finish.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 63-UFBGA (WLCSP) typically applied?
A:Dominant use cases:
- Mobile Devices: PMICs (e.g., Qualcomm SMB1396).
- IoT Modules: Bluetooth/Wi-Fi SoCs (e.g., Nordic nRF5340).
- Automotive Sensors: MEMS interfaces (e.g., Bosch BMI270). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.2 mm diameter).
- Solder Paste: Type 4 (5–15 µm particle size).
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for joint integrity.