5mm x 20mm

Q:What defines the physical structure of the 5mm x 20mm package?

A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment
- Central thermal pad (80% coverage) for efficient heat dissipation
- 24-pin layout with dual-row arrangement for balanced signal routing
- 1.0 mm ultra-thin profile for space-constrained applications

Q:Why choose the 5mm x 20mm package over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller than standard SOIC packages
- Thermal Performance: Direct PCB heat path reduces junction temperature by up to 15°C
- Electrical Benefits: Low-inductance design (<1nH) for high-frequency stability
- Reliability: Moisture-resistant substrate (MSL3 certified)

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 20.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C

Q:Where is the 5mm x 20mm package typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost regulators (e.g., TPS62130)
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2652R)
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12)

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad required
- Solder Paste: Type 4 solder recommended for fine-pitch printing
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process)
- Inspection: X-ray (AXI) mandatory for void detection