ALL CATEGORIES56-VFBGA
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
-
-
IC FLASH 128M PARALLEL 56BGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 307
-
-
IC FLASH 512M PARALLEL 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 598
-
-
IC FLASH 512M PARALLEL 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 732
-
-
NXP 74AVCH16T245EV,518 Transceiver, Translating, 800mV to 3.6V, VFBGA-56
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 489
-
-
IC TRANSCEIVER 16Bit 3ST 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 867
-
-
IC FLASH 256M PARALLEL 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 651
-
-
Bus XCVR Dual 16CH 3-ST Automotive 56Pin VFBGA T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 740
-
-
74LVCH Series 3-State 16Bit Bus Transceiver with Direction Pin - SSOP-48
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 647
-
-
74LVCH Series 3.6V SMT 3-State 16Bit 16Bit Buffer/Line Driver - SSOP-48
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 965
-
-
Buffer/Line Driver 16CH Non-Inverting 3-ST CMOS 56Pin VFBGA T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 287
-
-
Bus XCVR Dual 16CH 3-ST Automotive 56Pin VFBGA T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 982
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 49
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 409
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 705
-
-
Buffer/Line Driver 16CH Non-Inverting 3-ST BiCMOS 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 799
-
-
Buffer/Line Driver 16CH Non-Inverting 3-ST BiCMOS 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 56
-
-
Buffer/Line Driver 16CH Non-Inverting 3-ST BiCMOS 56Pin VFBGA T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 280
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 181
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 434
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 639
-
-
Buffer/Line Driver 16CH Non-Inverting 3-ST CMOS 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 195
-
-
Buffer/Line Driver 16CH Non-Inverting 3-ST CMOS 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 861
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 762
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 498
-
-
Bus XCVR Dual 16CH 3-ST 56Pin VFBGA T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 905
-
-
16Bit buffer/line driver; 5V input/output tolerant; 3-state
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 973
-
-
74LVC16244A; 74LVCH16244A - 16Bit buffer/line driver; 5V input/output tolerant; 3-state
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 765
-
-
74LVC16244A; 74LVCH16244A - 16Bit buffer/line driver; 5V input/output tolerant; 3-state
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 907
-
-
3.3V 16Bit edge-triggered D-type flip-flop; 3-state
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 647
-
-
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 8Element 56Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 983
-
-
3.3V 16Bit edge-triggered D-type flip-flop; 3-state
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 820
-
-
IC FLASH 512M PARALLEL 56BGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 639
-
-
IC FLASH 512M PARALLEL 56BGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 434
-
-
IC FLASH 512M PARALLEL 56BGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 834
-
-
IC FLASH 512M PARALLEL 56BGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 288
-
-
IC FLASH 256M PARALLEL 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 443
-
-
IC FLASH 128M PARALLEL 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 470
-
-
IC FLASH RAM 512M PARALLEL
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 952
-
-
MCU 32-bit ARM Cortex M7 RISC 1MB Flash 1.8V/2.5V/3.3V Medical 143-Pin WLCSP T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8679
-
-
Bus Exchange Switch 1Element 12CH 56Pin BGA MICROSTAR JUNIOR T/R
-
1 + 10 + 25 + 50 + >=100 -
1
-
-
MCP 1.8V 56-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 257
-
-
256Mb NOR + 128Mb PSRAM MCP
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
-
-
NOR Flash Parallel 3V/3.3V 512M-bit 64M x 8/32M x 16 100ns 56-Pin VFBGA T/R/Tray
-
1 + 10 + 25 + 50 + >=100 -
In-stock : 1
-
-
256Mb Parallel NOR Flash
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5538
-
-
Chip FLASH 64MBIT 70NS 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 438
-
-
Chip FLASH 64MBIT 70NS 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 727
-
-
Chip FLASH PAR NOR SLC 4MX16 FBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 386
-
-
Chip FLASH 32MBIT 70NS 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 488
-
-
Chip FLASH 32MBIT 70NS 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 455
-
-
Chip FLASH 128MBIT 85NS 56VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 361
-
Q:What defines the physical structure of 56-VFBGA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB connectivity.
- Central thermal pad: 4×4 mm coverage (80% area) for enhanced heat dissipation.
- 56-pin layout: Symmetric 7×8 ball grid array (BGA) arrangement.
- Ultra-thin profile: 0.6 mm height for space-constrained designs. -
Q:Why choose 56-VFBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent QFN packages.
- Thermal Performance: Direct PCB heat path via central pad reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance (<0.5 nH) design for high-frequency signals.
- Reliability: Moisture-resistant (MSL3) substrate with halogen-free materials. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm.
- Height: 0.6 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy balls with SnAgCu solder.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 56-VFBGA typically applied?
A:Dominant use cases:
- Power Converters: POL modules (e.g., TI TPS62825).
- RF Modules: 5G mmWave transceivers (e.g., ADI ADMV1013).
- Sensor Interfaces: MEMS accelerometers (e.g., ST LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array (0.3 mm diameter) under the central pad.
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory due to hidden solder joints.