ALL CATEGORIES54-TSOP (0.400, 10.16mm Width)
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- Description
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- Quantity
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SRAM Chip Async Single 2.5V/3.3V 16M-bit 1M x 16 10ns 54-Pin TSOP-II
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12096
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SDRAM SDR 64MX16 200MHZ 54TSOPII
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1946
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IC SRAM 16MBIT 10NS 54TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1572
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AS4C4M16S Series 256Mb (16M x 16) 166MHz CMOS SDRAM - TSOP II-54
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12787
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DRAM 512M 3.3V 133MHz 32M x 16 IND TEMP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3683
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IC SDRAM 64MBIT 166MHZ 54TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2361
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SD 16Mx16 PC200
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1649
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SD 8Mx16-6 166MHz CL3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 925
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SD 8Mx16-6 166MHz CL3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1806
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DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TSOP-II Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5493
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SD 32Mx16-75 PC133 Pb Free Ind Temp
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1866
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ESD Suppressor Diode Array Uni-Dir 30V 10Pin WSON T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 155
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Memory, ASYNC SRAMS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 474
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Memory, ASYNC SRAMS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 324
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Memory, ASYNC SRAMS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 411
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Memory, ASYNC SRAMS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 212
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Memory, ASYNC SRAMS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 481
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Memory, ASYNC SRAMS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 499
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SDRAM Memory IC 128Mb (8M x 16) Parallel 200MHz 4.5ns 54-TSOP II
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 19
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8MX8 SDRAM PLASTIC PBF TSOP 3.3V SD 8Mx8 PC133
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7680
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DRAM CHIP SDRAM 64M-BIT 8MX8 3.3V 54-PIN TSOP-II T
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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IC SDRAM 128MBIT 167MHZ 54TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2136
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DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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IC SDRAM 128MBIT 167MHZ 54TSOPII
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Dram chip sdram 512m-bit 64mx8 3.3v 54-pin tsop-ii tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6538
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DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54Pin TSOP-II T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1030
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IC SDRAM 512MBIT 133MHZ 54TSOPII
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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DRAM 128M, 3.3V, 143Mhz 8M x 16 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128
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DRAM 128M (8Mx16) 166MHz SDRAM 3.3v
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12
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dram 512m (64mx8) 143mhz industrial temp
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 868
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DRAM 256M (32Mx8) 133MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3530
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DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1838
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Memory, IC SDRAM 128MBIT 143MHZ 54TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1500
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DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TSOP-II
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1183
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DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II T/R/Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15
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16-Mbit (2M x 8) Static RAM,SRAM 16-Mbit (2M x 8) SRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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IC SRAM 16MBIT 8NS 54TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Memory, IC SRAM 16GBIT 56TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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IC SRAM 16MBIT 12NS 54TSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4800
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2M x 8 Static RAM; Density: 16 Mb; Organization: 2Mb x 8; Vcc (V): 3.0 to 3.6 V;,SRAM 2M x 8 CPG IND Fast Async SRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
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16-Mbit (1M x 16) Static RAM; Density: 16 Mb; Organization: 1Mb x 16; Vcc (V): 3.0 to 3.6 V;,SRAM 1Mx16 CPG Fast Async
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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1M x 16 Static RAM; Density: 16 Mb; Organization: 1Mb x 16; Vcc (V): 3.0 to 3.6 V;,SRAM 1M x 16 CPG COM Fast Async SRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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1M x 16 Static RAM; Density: 16 Mb; Organization: 1Mb x 16; Vcc (V): 3.0 to 3.6 V;,SRAM 1M x 16 CPG IND Fast Async SRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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DRAM 128Mb, 3.3V, 166Mhz 8M x 16 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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DRAM 64Mb, 3.3V, 143Mhz 4M x 16 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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DRAM 64Mb, 3.3V, 166Mhz 4M x 16 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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DRAM 256Mb, 3.3V, 143Mhz 16M x 16 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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SRAM 256Mb, 3.3V, 166Mhz 16M x 16 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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DRAM 256M (16M x 16) 3.3V SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 216
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Q:What defines the physical structure of 54-TSOP (0.400, 10.16mm Width)?
A:Key features include:
- Leadframe design: Exposed leads for surface-mount soldering.
- Standardized width: 10.16mm (0.400") body width for consistent PCB layout.
- Pin layout: 54-pin configuration with dual-row gull-wing leads.
- Low profile: Typical height of 1.0mm for space-constrained applications. -
Q:Why choose 54-TSOP (0.400, 10.16mm Width) over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than equivalent SOIC packages.
- Thermal Performance: Efficient heat dissipation through leadframe design.
- Electrical Benefits: Low-inductance leads for high-speed signal integrity.
- Reliability: Moisture-resistant (MSL3-rated) molding compound. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10.16mm × 20.0mm (0.400" × 0.787").
- Height: 1.0mm (nominal).
- Pin Pitch: 0.5mm (20 mil).
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 54-TSOP (0.400, 10.16mm Width) typically applied?
A:Dominant use cases:
- Memory Modules: NAND flash (e.g., Micron MT29F series).
- Networking ICs: Ethernet PHY chips (e.g., Broadcom BCM5461).
- Consumer Electronics: Display drivers in smart devices. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 0.1mm solder mask dams between pads to prevent bridging.
- Solder Paste: Type 3 or 4 recommended for fine-pitch leads.
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free process).
- Inspection: Optical or AXI required for lead coplanarity checks.