4-SIP
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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LNCT22PK01WW, 280mW, 380mW, 3.2V, Maximumof 3V, 3Pin 665nm, 791nm Laser Diode
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 641
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LNCT28PF01WW, 300mW, 380mW, Maximum of 3V, 3Pin 665nm, 791nm Laser Diode
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 808
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IXYS Introduces New 20A Optically Isolated AC Power Switch Utilizing Dual-Power SCR Outputs
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3489
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Hall Effect Sensor 1000mA Latch 2.5V/3.3V/5V/9V/12V/15V 4Pin TO-94 Bulk
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2137
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Motor / Motion / Ignition Controllers & Drivers 2 Phase Hall-Effect 18V Smart Fan CTRL
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3655
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SENSOR MAGNETIC 4PIN E-LINE,Board Mount Hall Effect / Magnetic Sensors 12V 4Pin E-Line Magnet Field Sensors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Magnetic Field Sensors,Board Mount Hall Effect / Magnetic Sensors 12V 4Pin E-Line Magnet Field Sensors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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SENSOR DIFF VACUUM GAGE 150PSI,Board Mount Pressure Sensors +/-150PSI 3V NO PORT DIFF,VAC GAGE UNAMP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30
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SENSOR VACUUM GAGE 100PSI,Board Mount Pressure Sensors +/-100psi BARBED 3V DIFF,VAC GAGE UNAMP
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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SENSOR DIFF VACUUM GAGE 100PSI,Board Mount Pressure Sensors +/-100psi BARBED 3V DIFF,VAC GAGE UNAMP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 360
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SENSOR DIFF VACUUM GAGE 1PSI,Board Mount Pressure Sensors +/-1PSI 3VDC NO PORT DIFF,VAC GAGE UNAMP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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XPCL Series, Differential, Gage, Vaccum Gage; Signal Conditioning: Unamplified; Pressure Range: #177 10.0 in H2O; Port Style: Button,Board Mount Pressure Sensors +/-10 IN H2O NO PORT DIFF,VAC GAGE 3VDC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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SENSOR ABSOLUTE 2-15PSIA,Board Mount Pressure Sensors +/-15psi 3V BARBED UNAMP VAC GAGE 5kOhm
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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VBSD1-SIP Series 0.3 A 1 W 3.3 V Single Output DC-DC Isolated Converter
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 177
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VBSD1-SIP Series 300 mA 1 W 3.3 V Single Output DC-DC Isolated Converter
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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VBSD1-SIP Series 67 mA 1 W 15 V Single Output DC-DC Isolated Converter
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Board Mount Pressure Sensors 0 to 30psid BUTTON UNAMP DIFF GAGE 12V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000000
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Pressure Sensor 0.5V to 4.5V -15psi to 15psi Differential Medical 4-Pin SIP Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 43
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Pressure Sensor 0.5V to 4.5V -5psi to 5psi Differential Medical 4-Pin SIP Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 19
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Solid State Relays - PCB Mount PCB SIP SSR 660VAC /10A, 24VDC, RN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Solid State Relays - PCB Mount PCB SIP SSR 660VAC /10A, 24VDC, ZC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Solid State Relays - PCB Mount PCB SIP SSR 240VAC /10A, 24VDC, ZC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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Solid State Relays - PCB Mount PCB SIP SSR 530VAC /10A, 24VDC, RN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 18
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Q:What defines the physical structure of 4-SIP?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 4-pin layout with single-row alignment: Simplified circuit integration.
- 1.0 mm ultra-thin profile: Saves vertical space in compact designs. -
Q:Why choose 4-SIP over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-4 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant (MSL3-rated) substrate for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.5×2.5 mm
- Height: 1.0 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is 4-SIP typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS61023).
- RF Modules: Bluetooth/Wi-Fi front-end circuits (e.g., CC2541).
- Sensor Interfaces: MEMS accelerometers (e.g., ADXL345). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (4×0.3 mm vias recommended).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (ramp rate 2°C/sec).
- Inspection: X-ray (AXI) mandatory for void detection (<10% tolerance).



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