48QFN

Q:What defines the physical structure of 48QFN?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: 5×5 mm coverage (80% area) for enhanced heat dissipation.
- 48-pin layout: Quad-flat no-lead (QFN) arrangement with perimeter pads.
- Ultra-thin profile: 0.8 mm thickness for space-constrained designs.

Q:Why choose 48QFN over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than equivalent TSSOP packages.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 rated).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 7×7 mm.
- Height: 0.8 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is 48QFN typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS54332).
- RF Modules: e.g., Bluetooth/Wi-Fi SoCs (e.g., nRF52840).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS3DH).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 µm) recommended.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).