48-UFQFN
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- Description
- Unite Price
- Quantity
- Operation
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ARM MCU, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 160 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 981
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ARM MCU, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 128 KB, 40 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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MCU 8Bit C8051F97x 8051 CISC 32KB Flash 3V 48Pin QFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 471
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STMICROELECTRONICS STM32L151C8U6A 32Bit Microcontroller, Ultra Low Power, ARM Cortex-M3, 32MHz, 64KB, 32KB, 48Pins, UFQFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 867
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ARM MCU, Access Line, STM32 Family STM32F0 Series Microcontrollers, ARM Cortex-M0, 32bit, 48 MHz
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 484
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ARM MCU, STM32 Family STM32G0 Series Microcontrollers, ARM Cortex-M0+, 32bit, 64 MHz, 64 KB, 8 KB New
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2500
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MCU 32Bit ARM Cortex M3 RISC 128KB Flash 2.5V/3.3V 48Pin VFQFPN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 349
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ARM MCU, STM32 Family STM32G4 Series Microcontrollers, ARM Cortex-M4F, 32bit, 170 MHz, 128 KB
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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MCU 32Bit STM32F ARM Cortex M0 RISC 128KB Flash 2.5V/3.3V 48Pin UFQFPN EP Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 756
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STMICROELECTRONICS STM32L152CBU6A 32Bit Microcontroller, Ultra Low Power, ARM Cortex-M3, 32MHz, 128KB, 32KB, 48Pins, UFQFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 317
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STMICROELECTRONICS STM32F042C4U6 32Bit Microcontroller, USB Line, ARM Cortex-M0, 48MHz, 16KB, 6KB, 48Pins, UFQFPN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 877
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ARM MCU, Ultra Low Power, STM32 Family STM32L1 Series Microcontrollers, ARM Cortex-M3, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 389
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MCU 32Bit ARM Cortex M3 RISC 256KB Flash 2.5V/3.3V 48Pin UFQFPN EP Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 283
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SolarSpec™ DC Socket Female Housing, 4.00 to 6mm² (10-12AWG) Cable, Bulk packaging, Cable Opening 8.4mm
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 58
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ARM MCU, ECOPACK®2, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 256 KB, 64 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 361
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ARM MCU, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 160 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 85
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ARM MCU, ECOPACK®2, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 256 KB, 160 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 161
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 256 KB, 64 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 670
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ARM MCU, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-R4F, 32bit, 80 MHz, 512 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Kinetis L 32-bit MCU, ARM Cortex-M0+ core, 256KB Flash, 48MHz, QFN 48
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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ARM MCU, STM32 Family STM32L0 Series Microcontrollers, ARM Cortex-M0+, 32bit, 32 MHz, 64 KB, 8 KB
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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ARM MCU, Ultra Low Power, STM32 Family STM32L1 Series Microcontrollers, ARM Cortex-M3, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 816
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MCU 32Bit STM32 ARM Cortex M4 RISC 512KB Flash 3.3V 48Pin UFQFPN EP Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 198
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Q:What defines the physical structure of 48-UFQFN?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 48-pin layout with peripheral array for optimized signal routing.
- 0.5 mm ultra-thin profile for space-constrained designs. -
Q:Why choose 48-UFQFN over alternatives?
A:Critical advantages:
- Miniaturization: 60% smaller than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance design for high-frequency applications.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 6×6 mm
- Height: 0.5 mm
- Pin Pitch: 0.35 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is 48-UFQFN typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi SoCs (e.g., CC2652R).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LSM6DSO). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (≥4 vias, 0.3mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.



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