ALL CATEGORIES488-TFBGA
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i.MX 7Dual:2x Cortex A7, 2x USB 2.0 OTG with PHY, PCIe, 2xSDIO/MMC, 2x Ethernet, Security
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 997
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Microprocessor, i.MX Family i.MX 7 Series, 32bit, 1GHz, 0.95V to 1.05V, TFBGA-488
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 297
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i.MX 7Solo:1x Cortex A7, 1x USB 2.0 OTG with PHY, 2x SDIO/MMC, Ethernet, Security
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 19
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Microprocessor, i.MX Family i.MX 7Dual Series, 32bit, 1GHz, 950mV to 1.05V, MAPBGA-488
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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i.MX 7Solo: Rev 1.3
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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I.MX 7SOLO: REV 1.3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 868
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MPU I.MX 7D 1.2GHZ 12X12 MAPBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 481
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I.MX 7DUAL: REV 1.3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 534
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i.MX 7Solo: Rev 1.3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 527
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SOC i.MX 7Solo ARM Cortex A7 488-Pin MAP-BGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 409
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i.MX 7Solo:1x Cortex A7, 1x USB 2.0 OTG with PHY, 2x SDIO/MMC, Ethernet, Security
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 147
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Microprocessor, i.MX Family i.MX 7 Series, 32bit, 1GHz, 0.95V to 1.05V, TFBGA-488
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 360
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SOC i.MX 7Dual ARM Cortex A7 488-Pin TFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 105
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ARM Microcontrollers - MCU i.MX 7Dual: 2x Cortex A7, 2x USB 2.0 OTG & PHY, PCIe, 2xSDIO/MMC, EPDC, CAN, 2x Ethernet, Security
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4710
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Q:What defines the physical structure of 488-TFBGA?
A:Key features include:
- Leadless bottom-mounted pads for direct PCB attachment.
- Central thermal pad (70% coverage) for enhanced heat dissipation.
- 488-pin layout with a staggered ball grid array (BGA) arrangement.
- 1.0 mm ultra-thin profile for space-constrained designs. -
Q:Why choose 488-TFBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than comparable QFP packages.
- Thermal Performance: Direct PCB heat path via the central thermal pad.
- Electrical Benefits: Low-inductance design for high-speed signals.
- Reliability: Moisture-resistant substrate (JEDEC MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 17 × 17 mm.
- Height: 1.0 mm.
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy balls with organic substrate.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 488-TFBGA typically applied?
A:Dominant use cases:
- High-performance computing: GPUs/FPGAs (e.g., Xilinx Artix-7).
- Networking equipment: 5G RF modules (e.g., Qualcomm QCN9074).
- Automotive electronics: ADAS sensor interfaces (e.g., NXP S32G). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under the central pad.
- Solder Paste: Type 4 solder (particle size 20–38 µm).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.