40-DIP (0.600", 15.24mm)
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MCU 8Bit AT87 80C51 CISC 32KB EPROM 5V 40Pin PDIP Stick
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 89
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MCU 8Bit AT87 80C51 CISC 16KB EPROM 5V 40Pin PDIP Stick
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 815
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Q:What defines the physical structure of 40-DIP (0.600", 15.24mm)?
A:Key features include:
- Through-hole mounting: Dual-row pins for robust PCB attachment.
- Standardized dimensions: 15.24mm (0.600") row spacing for compatibility.
- 40-pin layout: Pins arranged in two parallel rows (20 pins per side).
- Durable housing: Molded plastic body with ±2.54mm (0.1") pin pitch. -
Q:Why choose 40-DIP over alternatives?
A:Critical advantages:
- Ease of prototyping: Hand-soldering friendly for lab/testing environments.
- Mechanical stability: Secure pin insertion resists vibration/shock.
- Cost-effectiveness: Lower assembly complexity vs. SMD alternatives.
- Legacy compatibility: Direct replacement for older DIP-based designs. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 52.32mm × 15.24mm (2.06" × 0.600").
- Height: 7.62mm (0.300") typical.
- Pin Pitch: 2.54mm (0.1") center-to-center.
- Material: Plastic body with tin-plated copper alloy leads.
- Temp Range: -40°C to +85°C (industrial grade). -
Q:Where is 40-DIP typically applied?
A:Dominant use cases:
- Legacy electronics: Microcontrollers (e.g., 8051, Z80).
- Industrial controls: PLCs and relay drivers.
- Educational kits: Breadboard-friendly ICs (e.g., Op-amps, logic gates). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 1.0mm+ hole diameter for pin insertion; reinforce pads for repeated rework.
- Soldering: Wave soldering preferred; manual soldering at ≤ 350°C tip temperature.
- Cleaning: Use flux removers for post-assembly residue.
- Inspection: Visual check for pin alignment and solder fillets.



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