ALL CATEGORIES37.5 mm x 37.5 m
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MPU Core™ i3-4000M Processor RISC 64Bit 22nm 2.4GHz
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1 + 10 + 25 + 50 + >=100 -
1
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MPU Core™ i7-2760QM Processor RISC 64Bit 32nm 2.4GHz 988Pin FCPGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 732
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MPU Xeon 64Bit 3200MHz 1.35V/1.5V 1150Pin FCLGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 826
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MPU Core i7-4800MQ Processor RISC 64Bit 22nm 2.7GHz
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1 + 10 + 25 + 50 + >=100 -
1
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MPU Core™ i5-3475S Processor RISC 64Bit 22nm 2.9GHz 1155Pin FCLGA Tray
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1 + 10 + 25 + 50 + >=100 -
1
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MPU Core™ i7-4770 Processor RISC 64Bit 22nm 3.4GHz 1168Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 728
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MPU Xeon Processor E3-1260L RISC 64Bit 32nm 2.4GHz 1.5V 1155Pin LGA Tray
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1 + 10 + 25 + 50 + >=100 -
1
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MPU Core™ i5-3550S Processor RISC 64Bit 22nm 3GHz 1.5V 1155Pin FCLGA Tray
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1 + 10 + 25 + 50 + >=100 -
1
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MPU Xeon® Processor X3450 64Bit 45nm 2.66GHz 1.5V 1156Pin LGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 302
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MPU Core i3-4160 Processor RISC 64Bit 22nm 3.6GHz 1150Pin FCLGA Box/Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 190
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MPU Core™ i3-4330TE Processor RISC 64Bit 22nm 2.4GHz 1150Pin FCLGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 932
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MPU Core i5-4570 Processor RISC 64Bit 22nm 3.2GHz 1168Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 570
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MPU Core™ i5-4570S Processor RISC 64Bit 22nm 2.9GHz 1168Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3264
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CPU - Central Processing Units Xeon E3-1230v3 Quad CR 3.3GHz FCLGA1150
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4137
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CPU - Central Processing Units Core i5-520M Dual CR 2.4GHz FCPGA988
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 36
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Q:What defines the physical structure of the 37.5 mm × 37.5 mm PowerQFN package?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad (90% coverage): Maximizes heat dissipation.
- 64-pin layout with perimeter + matrix array: Balances I/O density and thermal performance.
- 1.2 mm ultra-thin profile: Saves vertical space in compact designs. -
Q:Why choose the 37.5 mm × 37.5 mm PowerQFN over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent TO-220 packages.
- Thermal Performance: Direct PCB heat path reduces θJA by 30% vs. wire-bonded designs.
- Electrical Benefits: Low-inductance (<0.5 nH) design for high-frequency switching.
- Reliability: Moisture-resistant (MSL3) substrate with Au/Ni/Pd finish. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 37.5 × 37.5 mm (±0.1 mm tolerance).
- Height: 1.2 mm (max).
- Pin Pitch: 0.5 mm (perimeter), 1.0 mm (thermal pad array).
- Material: Copper-alloy leads with exposed die attach pad.
- Temp Range: -40°C to +150°C (operational). -
Q:Where is the 37.5 mm × 37.5 mm PowerQFN typically applied?
A:Dominant use cases:
- Power Converters: High-current DC/DC modules (e.g., 100A VRM designs).
- Motor Drives: Inverter stages for automotive/BLDC systems (e.g., 48V traction).
- RF Power Amplifiers: Base station/LPA modules (e.g., 5G mMIMO). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array (0.3 mm diameter) under pad.
- Solder Paste: Type 4 (SnAgCu) with 80% stencil aperture ratio.
- Reflow Profile: Ramp rate ≤2°C/s, peak temp 250°C (±5°C).
- Inspection: X-ray (AXI) mandatory for voiding <15%.