ALL CATEGORIES324-LFBGA, CSPBGA
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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FPGA IGLOO2 Family 27696 Cells 1.2V 325Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 329
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA IGLOO?2 Family 27696 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
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HIGH-PERFORMANCE FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 928
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 11
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FPGA IGLOO?2 Family 27696 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 115
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FPGA IGLOO?2 Family 56340 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 537
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 437
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FPGA IGLOO®2 Family 56520 Cells 1.2V 325Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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HIGH-PERFORMANCE FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 292
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Field Programmable Gate Array, 27696-Cell, CMOS, PBGA325, 11 X 11MM, 0.5MM PITCH, ROHS COMPLIANT, FBGA-325
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 962
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HIGH-PERFORMANCE FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 378
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 819
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 776
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 432
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HIGH-PERFORMANCE FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 733
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 982
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 530
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FPGA IGLOO?2 Family 27696 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 941
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HIGH-PERFORMANCE FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 907
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HIGH-PERFORMANCE FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 565
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FPGA IGLOO?2 Family 27696 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 732
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FPGA IGLOO?2 Family 56340 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 369
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 109
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 321
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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HIGH-PERFORMANCE FPGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 115
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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HIGH-PERFORMANCE FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 837
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 695
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FPGA IGLOO?2 Family 27696 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 759
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 922
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HIGH-PERFORMANCE FPGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 735
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HIGH-PERFORMANCE FPGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 82
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 47
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FPGA IGLOO?2 Family 86316 Cells 1.2V 325-Pin FCBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8
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HIGH-PERFORMANCE FPGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 122
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HIGH-PERFORMANCE FPGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 352
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 511
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HIGH-PERFORMANCE FPGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 254
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 188
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FPGA IGLOO?2 Family 56520 Cells 1.2V 325-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 579
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10Bit FET Bus-Exchange Switches with -2V Undershoot Protection 24-TSSOP -40℃ to 85℃
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 214
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Conn Transition Box 10AWG
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 571
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Bus Exchange Switch 1Element 12CH 56Pin SSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 713
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IC FPGA 324CSBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 429
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Q:What defines the physical structure of 324-LFBGA (CSPBGA)?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity without protruding leads.
- Central thermal pad: 70% coverage (10×10 mm) for efficient heat dissipation.
- 324-pin layout: Matrix array (18×18) with fine-pitch arrangement.
- Ultra-thin profile: 1.2 mm height for space-constrained designs. -
Q:Why choose 324-LFBGA (CSPBGA) over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than traditional 324-BGA.
- Thermal Performance: Direct PCB heat path via thermal vias reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified) for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 15×15 mm.
- Height: 1.2 mm (max).
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy pads with solder mask-defined (SMD) finish.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 324-LFBGA (CSPBGA) typically applied?
A:Dominant use cases:
- Power Converters: High-current ICs (e.g., TI TPS54620).
- RF Modules: 5G/Wi-Fi 6 transceivers (e.g., Qualcomm QCN9074).
- Sensor Interfaces: MEMS arrays (e.g., Bosch BMI270). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).