256-LFBGA
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 424
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FPGA IGLOO®2 Family 27696 Cells 1.2V 256Pin VFBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 488
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FPGA SmartFusion2 Family 6060 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 597
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FPGA IGLOO?2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 373
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FPGA IGLOO?2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 139
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FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 308
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FPGA IGLOO?2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 177
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FPGA IGLOO?2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 64
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FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 569
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FPGA IGLOO?2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 222
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Automotive grade IGLOO?2 FPGAs offer the best-in-class security
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 493
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FPGA IGLOO?2 Family 12084 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 933
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FPGA SmartFusion2 Family 6060 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 64
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FPGA IGLOO?2 Family 12084 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 822
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FPGA IGLOO?2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 635
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FPGA IGLOO?2 Family 27696 Cells 1.2V Automotive 256-Pin FBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 327
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FPGA IGLOO?2 Family 12084 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 331
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FPGA IGLOO?2 Family 12084 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 74
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FPGA IGLOO?2 Family 12084 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 57
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FPGA IGLOO?2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 74
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FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 650
-
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FPGA IGLOO?2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 387
-
-
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA IGLOO?2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3
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FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 395
-
-
FPGA IGLOO?2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 510
-
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FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 169
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FPGA IGLOO®2 Family 27696 Cells 1.2V 256Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 238
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FPGA IGLOO?2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 844
-
-
FPGA SmartFusion2 Family 6060 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 505
-
-
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 446
-
-
FPGA IGLOO?2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 546
-
-
FPGA IGLOO?2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 868
-
-
FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 171
-
-
FPGA IGLOO?2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 507
-
-
FPGA SmartFusion2 Family 6060 Cells 65nm Technology 1.2V 256-Pin FBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 970
-
-
FPGA IGLOO®2 Family 12084 Cells 1.2V 256Pin VFBGA
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 351
-
-
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 773
-
-
FPGA IGLOO?2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 262
-
-
FPGA IGLOO?2 Family 12084 Cells 1.2V 256-Pin VFBGA Tray
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 300
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Q:What defines the physical structure of 256-LFBGA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures reliable solder joints and space efficiency.
- Central thermal pad (70% coverage): Enhances heat dissipation to the PCB.
- 256-pin layout with perimeter array: Optimizes I/O density and signal routing.
- 1.0 mm ultra-thin profile: Ideal for compact designs. -
Q:Why choose 256-LFBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than 256-TQFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 17×17 mm.
- Height: 1.0 mm (nominal).
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy pads with solder mask.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 256-LFBGA typically applied?
A:Dominant use cases:
- High-performance computing: GPUs/FPGAs (e.g., Xilinx Artix-7).
- Networking: Switch controllers (e.g., Broadcom BCM54xx).
- Automotive: ADAS processors (e.g., NXP S32V234). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).



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