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24-UFQFN
24-UFQFN
The 24-UFQFN (Ultra Fine Quad Flat No-Lead) is a surface-mount package designed for high-density circuits. Featuring leadless design, exposed thermal pad, and ultra-thin profile, it delivers superior heat dissipation and reduced signal interference. Typical dimensions are 4×4 mm with a height of 0.5 mm and a 0.5 mm pin pitch, making it ideal for power management ICs in portable devices, sensor modules, and IoT applications. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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IC MCU 32BIT 32KB FLASH 24QFN
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1 + 10 + 25 + 50 + >=100 -
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Voltage Level Translator 8-CH Bidirectional 24-Pin UQFN T/R
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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High Speed Basic USB Type-C Controller USB 3.1 3.3V/5V T/R 24-Pin QFN EP
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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1 + 10 + 25 + 50 + >=100 -
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Q:What defines the physical structure of 24-UFQFN?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 24-pin layout with peripheral array for optimized signal routing.
- 0.5 mm ultra-thin profile for space-constrained designs. -
Q:Why choose 24-UFQFN over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than standard QFN packages.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance design for high-frequency applications.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 4×4 mm
- Height: 0.5 mm
- Pin Pitch: 0.4 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is 24-UFQFN typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2541).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (≥4 vias, 0.3mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch reliability.
- Reflow Profile: Peak temp ≤ 245°C (follow JEDEC J-STD-020).
- Inspection: X-ray (AXI) mandatory for void detection.