2220 (5750 metric)
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Multilayer Ceramic Capacitors MLCC - SMD/SMT NEW GLOBAL PN KGF55DR72J105KV 630V 1uF X7R 2220 10% Flex Soft
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9611
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Ceramic Capacitors, CAP CER 0.68UF 200V X7R 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 537
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Ceramic Capacitors, CAP CER 0.47UF 200V X7R 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 428
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Ceramic Capacitors, CAP CER 0.33UF 200V X7R 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 384
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Ceramic Capacitors, CAP CER 0.22UF 450V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 598
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Ceramic Capacitors, CAP CER 0.15UF 630V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 343
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Ceramic Capacitors, CAP CER 0.47UF 250V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 667
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Ceramic Capacitors, CAP CER 0.22UF 450V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 578
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Ceramic Capacitors, CAP CER 0.15UF 630V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 373
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Ceramic Capacitors, CAP CER 0.47UF 250V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 674
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Ceramic Capacitors, CAP CER 0.27UF 630V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 473
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Ceramic Capacitors, CAP CER 0.33UF 450V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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Ceramic Capacitors, CAP CER 0.22UF 450V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 494
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Ceramic Capacitors, CAP CER 0.15UF 630V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 404
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Ceramic Capacitors, CAP CER 0.47UF 450V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4258
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Ceramic Capacitors, CAP CER 0.47UF 250V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1951
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Ceramic Capacitors, CAP CER 0.22UF 630V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3075
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Ceramic Capacitors, CAP CER 0.68UF 250V X7T 2220
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2196
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Multilayer Ceramic Capacitors (MLCC) - SMD/SMT - SMD/SMT .047UF 500V 10%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 34000
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Multilayer Ceramic Capacitors MLCC - SMD/SMT .22UF 500V 20%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 28000
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Multilayer Ceramic Capacitors (MLCC) - SMD/SMT - SMD/SMT .22uF 500volts 10%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 65500
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Multilayer Ceramic Capacitors (MLCC) - SMD/SMT - SMD/SMT .12uF 500volts 10%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 258000
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Multilayer Ceramic Capacitors MLCC - SMD/SMT 4.7nF 500volt 10%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 86310
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Multilayer Ceramic Capacitors (MLCC) - SMD/SMT - SMD/SMT .0039uF 1000volts 5%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 258000
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AVX VJ15MA0340KBA TVS Varistor, 30V, 34V, Automotive Series, 77V, 2220 [5650 Metric], Multilayer Varistor (MLV)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500000
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Q:What defines the physical structure of the 2220 (5750 metric) package?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 4-pin layout with symmetrical arrangement: Optimizes signal integrity.
- 0.8 mm ultra-thin profile: Saves vertical space in compact designs. -
Q:Why choose the 2220 (5750 metric) package over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than comparable DFN packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating) for harsh environments. -
Q:What are common technical specs for the 2220 (5750 metric) package?
A:Standard configurations (consult datasheets):
- Body Size: 2.2 × 2.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C (industrial grade) -
Q:Where is the 2220 (5750 metric) package typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi FEMs (SKY66421).
- Sensor Interfaces: e.g., MEMS accelerometers (LIS2DH12). -
Q:What are critical assembly guidelines for the 2220 (5750 metric) package?
A:Key recommendations:
- PCB Design: 4×4 thermal vias (0.3 mm diameter) under the central pad.
- Solder Paste: Type 4 solder (particle size 20–38 μm) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad alignment verification.



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