20-LSSOP (0.173, 4.40mm Width)
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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MCU 16Bit R8C CISC 16KB Flash 3.3V/5V 20Pin LSSOP Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 726
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MCU 16Bit R8C/M12A R8C CISC 2KB Flash 2.5V/3.3V/5V 20Pin LSSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 136
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MCU 16Bit R8C CISC 2KB Flash 3.3V/5V 20Pin LSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 788
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MCU 16Bit R8C CISC 4KB Flash 3.3V/5V 20Pin LSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 126
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MCU 16Bit RL78 CISC 16KB Flash 1.8V/2.5V/3.3V 20Pin LSSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 324
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MCU 16Bit RL78 CISC 8KB Flash 2.5V/3.3V/5V 20Pin LSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 794
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MCU 16Bit RL78 RL78 CISC 2KB Flash 2.5V/3.3V/5V 20Pin LSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 332
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MCU 16Bit R8C R8C CISC 8KB Flash 3.5V/5V Automotive 20Pin LSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 45
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MCU 16Bit R8C CISC 4KB Flash 3.3V/5V 20Pin LSSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4500
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MCU 16Bit R8C CISC 4KB Flash 3.3V/5V 20Pin LSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 819
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MCU 16Bit R8C CISC 4KB Flash 3.3V/5V 20Pin LSSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 612
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MCU 16Bit RL78 CISC 8KB Flash 2.5V/3.3V/5V 20Pin LSSOP Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 123
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MCU 16Bit R8C CISC 16KB Flash 3.3V/5V 20Pin LSSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 532
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MCU 16Bit RL78 RL78 CISC 16KB Flash 1.8V/2.5V/3.3V 20Pin LSSOP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 533
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Fuseholder, Panel Mount, Shock Safe, 250V, 10A, 5 x 20mm, Quick Connect, Fingergrip Cap
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 982
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MCU 16Bit R8C CISC 4KB Flash 3.3V/5V 20Pin LSSOP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 385
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MCU 16Bit R8C CISC 16KB Flash 3.3V/5V 20Pin LSSOP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 467
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Q:What defines the physical structure of 20-LSSOP?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: ~60% coverage (2.8mm × 4.0mm) for heat dissipation.
- 20-pin layout: Dual-row gull-wing leads for compact spacing.
- Ultra-thin profile: 1.0mm height maximizes space efficiency. -
Q:Why choose 20-LSSOP over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than SOIC-20.
- Thermal Performance: Direct PCB heat path via exposed pad.
- Electrical Benefits: Low-inductance (<1nH) leadframe design.
- Reliability: Moisture-resistant (MSL3) substrate. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 6.5mm × 4.4mm.
- Height: 1.0mm.
- Pin Pitch: 0.65mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C. -
Q:Where is 20-LSSOP typically applied?
A:Dominant use cases:
- Power Management: Buck converters (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2541).
- Sensor Interfaces: MEMS accelerometers (e.g., ADXL345). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.3mm diameter).
- Solder Paste: Type 4 (5–15μm particles) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad solder joint verification.



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