ALL CATEGORIES2020 (5050 metri...
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Common Mode Chokes Dual 100Ω 100MHz 6A 13mOhm DCR SMD T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5400
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Common Mode Choke Coil Wire Wound Type for Large Current(2014/2020 Size)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 90806
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Common Mode Choke Coil Wire Wound Type for Large Current(2014/2020 Size)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 150
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Common Mode Choke Coil Wire Wound Type for Large Current(2014/2020 Size)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Common Mode Choke Coil Wire Wound Type for Large Current(2014/2020 Size)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 102910
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Ind Common Mode Choke Wirewound 1KΩ 100MHz Ferrite 1.5A 2020 Embossed T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5400
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Q:What defines the physical structure of the 2020 (5050 metric) package?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment and space efficiency.
- Central thermal pad: Provides ~70% coverage for enhanced heat dissipation.
- 4-pin layout with symmetrical arrangement: Optimized for balanced current distribution.
- 0.6 mm ultra-thin profile: Ideal for low-profile applications. -
Q:Why choose the 2020 (5050) package over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than traditional SOT-23 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15°C.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating) for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 2.0 mm (5050 metric).
- Height: 0.6 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is the 2020 (5050) package typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (TPS62090).
- RF Modules: e.g., Bluetooth/Wi-Fi FEMs (SKY66421).
- Sensor Interfaces: e.g., MEMS accelerometers (LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (≥4 vias, 0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.