201-UFBGA
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 180 MHz, 2 MB, 384 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 488
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ARM MCU, Ethernet MAC, Camera Interface, STM32 Family STM32F2 Series Microcontrollers
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 424
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ARM MCU, STM32 Family STM32F4 Series Microcontrollers, ARM Cortex-M4, 32bit, 168 MHz, 1 MB, 196 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 860
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ARM MCU, ARM Cortex-M7 Microcontrollers, ARM Cortex-M7, 32bit, 216 MHz, 2 MB, 512 KB
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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ARM MCU, STM32 Family STM32F7 Series Microcontrollers, ARM Cortex-M7, 32bit, 216 MHz, 512 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 484
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ARM MCU, ARM Cortex-M7 Microcontrollers, ARM Cortex-M7, 32bit, 216 MHz, 1 MB, 320 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 595
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MCU 32Bit ARM Cortex M3 RISC 512KB Flash 2.5V/3.3V 201Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 80
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ARM MCU, STM32 Family STM32F7 Series Microcontrollers, ARM Cortex-M7, 32bit, 216 MHz, 64 KB, 256 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 539
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ARM MCU, STM32 Family STM32H7 Series Microcontrollers, ARM Cortex-M7, 32bit, 400 MHz, 2 MB, 1 MB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12000
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ARM MCU, STM32 Family STM32H7 Series Microcontrollers, ARM Cortex-M7, 32bit, 400 MHz, 128 KB, 1 MB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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MCU 32-bit ARM Cortex M7 RISC 2MB Flash 3.3V 201-Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 292
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MCU 32-bit ARM Cortex M7 RISC 1MB Flash 3.3V 201-Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 305
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ARM MCU, STM32 Family STM32F7 Series Microcontrollers, ARM Cortex-M7, 32bit, 216 MHz, 1 MB, 340 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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MCU 32-bit ARM Cortex M7 RISC 512KB Flash 3.3V 201-Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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MCU 32-bit ARM Cortex M4 RISC 1MB Flash 2.5V/3.3V 201-Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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MCU 32-bit ARM Cortex M4 RISC 1MB Flash 2.5V/3.3V 201-Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 55
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MCU 32-bit ARM Cortex M4 RISC 512KB Flash 2.5V/3.3V 201-Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1008
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MCU 32-bit ARM Cortex M4 RISC 2MB Flash 2.5V/3.3V 201-Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4440
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MCU 32-bit ARM Cortex M4 RISC 512KB Flash 2.5V/3.3V 201-Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9000
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ARM MCU, ART Accelerator, STM32 Family STM32F7 Series Microcontrollers, ARM Cortex-M7, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 14
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MCU 32Bit ARM Cortex M4 RISC 2048KB Flash 2.5V/3.3V 201Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 144
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ARM MCU, High Performance, STM32 Family STM32F4 Series Microcontrollers, ARM Cortex-M4, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 735
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ARM MCU, High Performance, STM32 Family STM32F4 Series Microcontrollers, ARM Cortex-M4, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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ARM MCU, ART Accelerator, STM32 Family STM32F7 Series Microcontrollers, ARM Cortex-M7, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 64
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MCU 32Bit ARM Cortex M3 RISC 1024KB Flash 2.5V/3.3V 201Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 563
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MCU 32Bit STM32 ARM Cortex M4 RISC 2048KB Flash 3.3V/5V 201Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 773
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ARM MCU, High Performance, STM32 Family STM32F4 Series Microcontrollers, ARM Cortex-M4, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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ARM MCU, High Performance, STM32 Family STM32F4 Series Microcontrollers, ARM Cortex-M4, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4
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Q:What defines the physical structure of 201-UFBGA?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 201-pin layout with a grid array arrangement for high-density interconnects.
- 0.8 mm ultra-thin profile for space-constrained designs. -
Q:Why choose 201-UFBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than comparable QFN packages.
- Thermal Performance: Direct PCB heat path via the central thermal pad.
- Electrical Benefits: Low-inductance design for high-speed signal integrity.
- Reliability: Moisture-resistant substrate (JEDEC MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10×10 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy pads with solder mask definition.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 201-UFBGA typically applied?
A:Dominant use cases:
- Power Converters: e.g., POL modules (e.g., TI TPS62130).
- RF Modules: e.g., 5G mmWave transceivers (e.g., ADI ADMV4821).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., ST LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under the central pad (≥4 vias, 0.3mm diameter).
- Solder Paste: Type 4 solder paste for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (follow JEDEC J-STD-020).
- Inspection: X-ray (AXI) mandatory for void detection.



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