ALL CATEGORIES1924-BBGA, FCBGA
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 402
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 762
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 497
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 540
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 553
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 661
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 993
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 531
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 792
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Ethernet Switch 5Port 10Mbps/100Mbps 100Mbps 128Pin PQFP Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 866
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Virtex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 549
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Virtex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 402
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Virtex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 671
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Virtex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Virtex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 597
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Virtex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 291
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Kintex UltraScale FPGA 728 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 291
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Kintex UltraScale FPGA 832 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 688
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FPGA, Kintex UltraScale, MMCM, PLL, 728 I/O's, 850 MHz, 1451100 Cells, 922 mV to 979 mV, FCBGA-1924
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 59
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Kintex UltraScale FPGA 832 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 315
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Kintex UltraScale FPGA 728 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 259
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FPGA, Kintex UltraScale, MMCM, PLL, 728 I/O's, 725 MHz, 1451100 Cells, 922 mV to 979 mV, FCBGA-1924
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 507
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FPGA, Kintex UltraScale, MMCM, PLL, 832 I/O's, 725 MHz, 1451100 Cells, 922 mV to 979 mV, FCBGA-1924
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 118
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Kintex UltraScale FPGA 832 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 996
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FPGA, Kintex UltraScale, MMCM, PLL, 728 I/O's, 630 MHz, 1451100 Cells, 922 mV to 979 mV, FCBGA-1924
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 839
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FPGA, Kintex UltraScale, MMCM, PLL, 728 I/O's, 630 MHz, 1451100 Cells, 922 mV to 979 mV, FCBGA-1924
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 749
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Kintex UltraScale FPGA 832 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 306
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Kintex UltraScale FPGA 832 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 778
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Kintex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 787
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Kintex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16
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Kintex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 978
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Kintex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 313
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Kintex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 607
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Kintex UltraScale FPGA 624 I/O 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 278
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IC FPGA 1924FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 14
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Virtex-7 FPGA 720 I/O 1926FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 990
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Virtex-7 FPGA 720 I/O 1926FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 275
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Virtex-7 FPGA 900 I/O 1930FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520
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Virtex-7 FPGA 720 I/O 1926FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 585
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Virtex-7 FPGA 720 I/O 1926FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 973
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Virtex-7 FPGA 900 I/O 1930FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 842
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Virtex-7 FPGA 720 I/O 1926FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 228
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Virtex-7 FPGA 1000 I/O 1930FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 131
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Virtex-7 FPGA 720 I/O 1926FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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FPGA, Virtex-7, MMCM, PLL, 1000 I/O's, 710 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1930
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA, Virtex-7, MMCM, PLL, 720 I/O's, 710 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1926
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 389
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FPGA, Virtex-7, MMCM, PLL, 1000 I/O's, 710 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1930
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 443
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Virtex-7 FPGA 600 I/O 1927FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 429
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Virtex-7 FPGA 720 I/O 1926FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 893
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Virtex-7 FPGA 1000 I/O 1930FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 549
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Q:What defines the physical structure of 1924-BBGA, FCBGA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connection for low inductance.
- Central thermal pad: 10×10 mm coverage (80% area) for efficient heat dissipation.
- 1924-pin layout: Staggered ball grid array (BGA) with 0.8 mm pitch.
- Ultra-thin profile: 1.2 mm package height for space-constrained designs. -
Q:Why choose 1924-BBGA, FCBGA over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than 2567-LGA packages.
- Thermal Performance: Direct PCB heat path via thermal vias (6 W/mK conductivity).
- Electrical Benefits: Low-inductance (<0.5 nH) and high-speed signal integrity (up to 25 Gbps).
- Reliability: Moisture-resistant substrate (MSL-3 certified) and halogen-free materials. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 23×23 mm.
- Height: 1.2 mm.
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy balls with lead-free finish (SnAgCu).
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 1924-BBGA, FCBGA typically applied?
A:Dominant use cases:
- High-performance computing: GPUs (e.g., NVIDIA A100 modules).
- Telecom/RF: 5G mmWave beamforming ICs (e.g., Qualcomm QPM56xx).
- Automotive: ADAS processors (e.g., NXP S32G). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for hidden joint defects.