16-SOIC (0.295", 7.50mm Width)
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- Description
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LF2113BTR
Manufacturer: IXYS Integrated Circuits Division
Package/Case: 16-SOIC (0.295", 7.50mm Width)
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GATE DRIVER HIGH/LOW SIDE 2A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8004
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LF2110BTR
Manufacturer: IXYS Integrated Circuits Division
Package/Case: 16-SOIC (0.295", 7.50mm Width)
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GATE DRIVER HIGH/LOW SIDE 2A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7330
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IS25LP512M-RMLA3
Manufacturer: ISSI, Integrated Silicon Solution Inc
Package/Case: 16-SOIC (0.295", 7.50mm Width)
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IC FLASH 512MBIT SPI/QUAD 16SOIC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5606
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IS25LP016D-JMLE
Manufacturer: ISSI, Integrated Silicon Solution Inc
Package/Case: 16-SOIC (0.295", 7.50mm Width)
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IC FLASH 16MBIT SPI/QUAD 16SOIC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7162
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Q:What defines the physical structure of 16-SOIC (0.295", 7.50mm Width)?
A:Key features include:
- Gull-wing leads: Standard outward-bent pins for reliable PCB mounting.
- Compact body: 7.50mm width with standardized 16-pin layout (dual-row).
- Moderate profile: Typical height of 2.35mm for balanced space savings.
- Plastic molded body: Lightweight and durable epoxy resin construction. -
Q:Why choose 16-SOIC over alternatives?
A:Critical advantages:
- Space Efficiency: 30% smaller footprint than DIP-16, ideal for dense PCBs.
- Ease of Assembly: Gull-wing leads simplify soldering (hand or reflow).
- Electrical Performance: Low-inductance leads for stable signal integrity.
- Cost-Effective: Mass-production friendly with standardized dimensions. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10.30mm × 7.50mm (L×W).
- Height: 2.35mm (typical).
- Pin Pitch: 1.27mm (50 mil).
- Material: Copper-alloy leads with Sn/Pb or lead-free plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 16-SOIC typically applied?
A:Dominant use cases:
- Analog ICs: Op-amps (e.g., LM358), voltage regulators (e.g., LM7805).
- Digital Logic: Serial interfaces (e.g., MAX232), microcontrollers.
- Communication: CAN transceivers (e.g., MCP2551). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Ensure pad spacing matches 1.27mm pitch; avoid excessive trace bends.
- Solder Paste: Type 3 recommended for fine-pitch reliability.
- Reflow Profile: Peak temperature ≤ 260°C (lead-free) or 240°C (Sn/Pb).
- Inspection: Visual or AOI for lead alignment; X-ray optional unless for voids.



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