ALL CATEGORIES16-SMD Module
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IC TRANSCEIVER 1/1 MODULE
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6817
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SENSOR 0.07PSID 0.08" 16BIT 1SMD
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7719
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IC AMP LTE 2.3GHZ-2.7GHZ 16MCM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9455
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IC AMP 4G/5G 3.3-3.6GHZ 16MCM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5519
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IC AMP LTE 3.4GHZ-3.6GHZ 16MCM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9412
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IC AMP LTE 900MHZ-990MHZ 16MCM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5089
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IC AMP LTE 800MHZ-900MHZ 16MCM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5673
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IC AMP GPS 1.805-1.88GHZ 16MCM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7429
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IC AMP LTE 5.15GHZ-5.9GHZ 16SMD
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8276
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DC DC CONVERTER 3.3V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7582
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IC DSP AUDIOLOGY IIC 16SIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520
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Automation Module, 2FSK, GFSK, GMSK, OOK, ASK, 500Kbps, 870MHz, 1.8V to 3.6V, SPI, UART
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 532
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Bluetooth v5.0 (BLE) SMART SOC Class II IoT 0.01Mbps 3.3V 16-Pin Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Bluetooth 4.2, 1.9V to 3.6V Supply, RN4871 Series Range, 10Mbps, -90dBm Sensitivity
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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Pre-configured DSP System for Hearing Aids, with up to 8 WDRC channels
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25
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Bluetooth v5.0 and Thread 802.15 Combo Module
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Bluetooth v5.0 and Thread 802.15 Combo Module
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Bluetooth v5.0 and Thread 802.15 Combo Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Bluetooth 5 Modules with Amplifier
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 173
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Bluetooth Low Energy (BLE) Smart module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 615
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Bluetooth Low Energy (BLE) Smart module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3338
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Bluetooth 4.2, 1.9V to 3.6V Supply, BM71 Series Range, -90dBm Sensitivity
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 118
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GPS LNA WITH PRE & POST FILTER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2397
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RF AMPLIFIERS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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RF Module 16-Pin SMD Module Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2576
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169-170MHZ 4X4 FEM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2176
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Bluetooth Modules (802.15.1) nRF52810 Bluetooth 5 module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2311
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Bluetooth Modules (802.15.1) Micro nRF52832 BLE 5 module, 7.8x8.8x1.3mm, castellated pins
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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IC TRANSCEIVER 1/1 16SMD
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5600
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IC TRANSCEIVER 1/1 MODULE
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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RF Modules & Development USB Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2083
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RF Modules & Development RF Receiver 433MHz
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 14666
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RECEIVER RF 433MHZ SMT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 78
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RF Modules & Development RF Receiver 418MHz
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 325
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Receiver rf 418mhz smt
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 460
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LR Series 3.6 V 7 mA 10 000 bps Surface Mount RF Receiver
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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RECEIVER RF 315MHZ SMT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3582
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160MHZ DUAL WAVEFROM GEN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13
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Q:What defines the physical structure of the 16-SMD Module?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 16-pin layout with dual-row arrangement: Optimizes space efficiency.
- 1.0 mm ultra-thin profile: Ideal for compact designs. -
Q:Why choose the 16-SMD Module over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-16 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is the 16-SMD Module typically applied?
A:Dominant use cases:
- Power Converters: e.g., DC-DC buck modules (TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (CC2640).
- Sensor Interfaces: e.g., MEMS accelerometers (LIS3DH). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under the central pad (0.3mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.