1517-BBGA, FCBGA
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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DSP Fixed-Point/Floating-Point 32Bit 1200MHz/1400MHz 9800MIPS 1517Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
1
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Digital Signal Processors & Controllers - DSP, DSC Multicore DSP+ARM KeyStone II SoC
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1 + 10 + 25 + 50 + >=100 -
1
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1517
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 587
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Zynq UltraScale+ MPSoC: EV Device SOC CORTEX-A53 1517FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 526
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1517
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 116
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1517
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 469
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1517
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 169
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Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-1517
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 904
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1517FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 237
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Zynq UltraScale+ MPSoC: EG Device SOC CORTEX-A53 1517FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 703
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Q:What defines the physical structure of 1517-BBGA, FCBGA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad: 70% coverage for efficient heat dissipation.
- 1517-pin layout: Arrayed in a staggered configuration for high-density interconnects.
- Ultra-thin profile: 1.2 mm height for space-constrained designs. -
Q:Why choose 1517-BBGA, FCBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than traditional BGA packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 40×40 mm.
- Height: 1.2 mm.
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy leads with organic substrate.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 1517-BBGA, FCBGA typically applied?
A:Dominant use cases:
- High-performance computing: GPUs (e.g., NVIDIA A100 modules).
- Telecom infrastructure: 5G RF front-end modules (e.g., Qualcomm QTM527).
- Automotive ECUs: ADAS processors (e.g., NXP S32G). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4+2 layer stackup with thermal vias under the pad.
- Solder Paste: Type 4 (5–15 µm particle size) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<10%).



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