144-TQFP

Q:What defines the physical structure of 144-TQFP?

A:Key features include:
- Leadframe design: Exposed leads on all four sides for robust connectivity.
- Central thermal pad: 10×10 mm coverage (70% of package base area) for enhanced heat dissipation.
- 144-pin layout: Quad flat arrangement with 0.5 mm pitch for high-density integration.
- Low profile: 1.0 mm ultra-thin body thickness for space-constrained applications.

Q:Why choose 144-TQFP over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than 144-LQFP while maintaining pin count.
- Thermal Performance: Direct PCB heat sinking via central pad (θJA reduced by 25% vs. non-padded variants).
- Electrical Benefits: Short lead lengths for low-inductance (<1 nH) signal paths.
- Reliability: Moisture-resistant (MSL3) epoxy substrate for harsh environments.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 20×20 mm (±0.2 mm tolerance).
- Height: 1.0 mm (nominal).
- Pin Pitch: 0.5 mm (uniform).
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is 144-TQFP typically applied?

A:Dominant use cases:
- Embedded Systems: Microcontrollers (e.g., STM32H7 series).
- Networking: Ethernet PHY ICs (e.g., KSZ9031).
- Automotive: ECU interfaces (e.g., Infineon XMC4000).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array (0.3 mm diameter) under central pad.
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch printing.
- Reflow Profile: Ramp rate ≤2°C/s, peak temp ≤245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% allowable).