144-LQFP

Q:What defines the physical structure of 144-LQFP?

A:Key features include:
- Leadframe-based design: Exposed gull-wing leads for robust PCB mounting.
- Central thermal pad: Optional 10×10 mm pad for enhanced heat dissipation.
- High pin density: 144-pin layout with perimeter-lead arrangement (4 sides).
- Low profile: Standard 1.4 mm package height.

Q:Why choose 144-LQFP over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than 144-PQFP.
- Thermal Performance: Exposed die pad reduces θJA by ~15% vs. non-thermal variants.
- Electrical Benefits: Short lead lengths minimize inductance (<1 nH typical).
- Reliability: Molded compound with MSL3 moisture resistance.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 20×20 mm (±0.2 mm tolerance).
- Height: 1.4 mm (nominal).
- Pin Pitch: 0.5 mm (standard fine-pitch).
- Material: Copper-alloy leads with Sn/Pb or Pb-free plating.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is 144-LQFP typically applied?

A:Dominant use cases:
- Embedded Systems: Microcontrollers (e.g., STM32F4 series).
- Communication ICs: Ethernet PHYs (e.g., DP83848).
- Industrial Control: Motor drivers (e.g., DRV8847).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 0.1 mm solder mask dams between pads; 4×4 thermal via array under pad.
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free) with 60–90 sec above 217°C.
- Inspection: AXI (Automated X-ray) required for joint integrity checks.