1411 (3528 Metri...
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Tantalum Capacitors - Solid SMD 2.2uF, 50.0V, +/-20% -55C +125C
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 575
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Cap Tant Solid 100uF 6.3V B CASE 10% (3.5 X 2.8 X 1.9mm) SMD 3528-21 0.7Ω 125℃ T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Chip tantalum capacitors (Fail-safe open structure type)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500000
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Cap Tant Solid 6.8uF 16V B CASE 20% (3.5 X 2.8 X 1.9mm) SMD 3528-21 125C Plastic T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 226800
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Chip tantalum capacitors (Fail-safe open structure type)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 42000
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Chip tantalum capacitors (Fail-safe open structure type)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 458900
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Chip tantalum capacitors (Fail-safe open structure type)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500000
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Chip tantalum capacitors (Fail-safe open structure type)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5880
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Chip tantalum capacitors (Fail-safe open structure type)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500000
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Chip tantalum capacitors with open-function built-in
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Chip tantalum capacitors (Fail-safe open structure type)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500000
-
-
Chip tantalum capacitors (Fail-safe open structure type)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 42000
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Chip tantalum capacitors (Fail-safe open structure type)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 42000
-
-
Chip tantalum capacitors (Fail-safe open structure type)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Cap Tant Solid 22uF 6.3V B CASE 20% (3.5 X 2.8 X 1.9mm) SMD 3528-21 125C Plastic T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500000
-
-
Chip tantalum capacitors (Fail-safe open structure type)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
-
-
Chip tantalum capacitors (Fail-safe open structure type)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 840000
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Q:What defines the physical structure of 1411 (3528 Metric)?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: ~60% coverage for efficient heat dissipation.
- 4-pin layout with dual-side symmetry: Balanced electrical routing.
- Ultra-thin profile: 0.8 mm height for space-constrained designs. -
Q:Why choose 1411 (3528 Metric) over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.5 × 2.8 mm
- Height: 0.8 mm
- Pin Pitch: 1.0 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is 1411 (3528 Metric) typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TI TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., nRF52840).
- Sensor Interfaces: MEMS sensors (e.g., Bosch BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4+ thermal vias under central pad (0.3 mm diameter).
- Solder Paste: Type 4 (5–15 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).



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