ALL CATEGORIES132-UFBGA
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IC MCU 32BIT 2MB FLASH 132UFBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9073
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IC MCU 32BIT 2MB FLASH 132UFBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8766
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IC MCU 32BIT 1MB FLASH 132UFBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9941
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ARM MCU, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 1 MB, 320 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 91
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 1 MB, 128 KB
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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IC MCU 32BIT 1MB FLASH 132UFBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 348
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IC MCU 32BIT 384KB FLASH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 111
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16/32-BITS MICROS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 993
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16/32-BITS MICROS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 666
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ARM MCU, ECOPACK®2, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 128 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 716
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IC MCU 32BIT 1MB FLASH 132UFBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 706
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 1 MB, 320 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2496
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 1 MB, 320 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 741
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ARM MCU, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 1 MB, 320 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24900
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ARM MCU, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 320 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1321
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MCU 32-bit ARM Cortex M4 RISC 1MB Flash 1.8V/2.5V/3.3V 132-Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2500
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ARM MCU, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 128 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1547
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ARM MCU, ARM Cortex-M4 Microcontrollers, ARM Cortex-M4, 32bit, 80 MHz, 512 KB, 128 KB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 52
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MCU 32Bit STM32 ARM Cortex M4 RISC 1024KB Flash 1.8V/2.5V/3.3V 132Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 964
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ARM MCU, Ultra Low Power, STM32 Family STM32L4 Series Microcontrollers, ARM Cortex-M4, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3500
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MCU 32Bit ARM Cortex M3 RISC 512KB Flash 2.5V/3.3V 132Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 214
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ARM MCU, Ultra Low Power, STM32 Family STM32L1 Series Microcontrollers, ARM Cortex-M3, 32bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 298
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MCU 32Bit ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 132Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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ARM Microcontrollers - MCU Ultra-low-power with FPU ARM Cortex-M4 MCU 120 MHz with 2048 kbytes Flash, USB OTG, DFSDM, CHROM-ART, AES-256, HASH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2483
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MCU 32Bit STM32L ARM Cortex M3 RISC 384KB Flash 1.8V/2.5V/3.3V 132Pin UFBGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9500
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STMICROELECTRONICS STM32L162QDH6 32Bit Microcontroller, Ultra Low Power, ARM Cortex-M3, 32MHz, 384KB, 48KB, 132Pins, BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9500
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ARM Microcontrollers - MCU 32B Cortex-M3 LCD 384Kb Flsh 32MHz CPU
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9500
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ARM Microcontrollers - MCU STM32L15 Low Power M3 384kB 32MHz MCU
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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MCU 32Bit STM32L ARM Cortex M3 RISC 256KB Flash 1.8V/2.5V/3.3V 132Pin UFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 416
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Q:What defines the physical structure of 132-UFBGA?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (70% coverage) for enhanced heat dissipation.
- 132-pin layout with perimeter ball grid array (BGA) arrangement.
- 0.8 mm ultra-thin profile for space-constrained designs. -
Q:Why choose 132-UFBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via the central thermal pad.
- Electrical Benefits: Low-inductance design for high-speed signal integrity.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 8.0 × 8.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy balls with SAC305 solder.
- Temp Range: -40°C to +125°C. -
Q:Where is 132-UFBGA typically applied?
A:Dominant use cases:
- Mobile processors (e.g., Qualcomm Snapdragon SoCs).
- RF modules (e.g., Wi-Fi/Bluetooth ICs).
- Embedded systems (e.g., IoT sensor hubs). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under the central pad (4×4 array minimum).
- Solder Paste: Type 4 solder recommended for fine-pitch balls.
- Reflow Profile: Peak temp ≤ 245°C (avoid exceeding 250°C).
- Inspection: X-ray (AXI) mandatory due to hidden solder joints.