1206 (3216 Metri...
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EMI Filter 3-Terminal 25dB 6A 50VDC Flat Style SMD T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 339
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Var MLV 14VAC/16VDC 200A 22V to 27V 1206 SMD Automotive T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 640
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PTC Resettable Fuse 0.16A(hold) 0.45A(trip) 48VDC 10A 0.6W 0.3s 1.1Ω SMD Solder Pad 3.5 X 1.8 X 0.75mm T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1210
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Cap Tant Polymer 10uF 10VDC A CASE 20% (3.2 X 1.6 X 1.6mm) SMD 3216-18 0.2 Ohm 125°C T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 172
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PTC Resettable Fuse 0.35A(hold) 0.75A(trip) 16VDC 100A 0.4W 0.1s 0.3Ω SMD Solder Pad 3.5 X 1.8 X 0.75mm T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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PTC Resettable Fuse 0.05A(hold) 0.15A(trip) 60VDC 10A 0.4W 1.5s 3.6Ω SMD Solder Pad 3.5 X 1.8 X 0.85mm T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13359
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PTC Resettable Fuse 2A(hold) 3.5A(trip) 6VDC 100A 0.8W 1.5s 0.018Ω SMD Solder Pad 3.5 X 1.8 X 1.6mm T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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Varistors MULTI-LAYER MULTI LINE VARISTOR SMF
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9586000
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MLA Series 1206 48VDC 40V RMS 100V Clamp 180A 350pF SMT Multilayer Varistor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 130000
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RESISTOR, VOLTAGE DEPENDENT, 14V, 0.1J, SURFACE MOUNT, CHIP, 1206, ROHS COMPLIANT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9586000
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Tantalum Capacitors - Solid SMD 10volts 4.7uF 10%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Tantalum Capacitors - Solid SMD 25volts 1uF 10%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 36000
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100 Ohm ±5% 62.5mW Power Per Element Isolated 4 Resistor Network/Array ±200ppm/°C 1206 (3216 Metric), Convex, Long Side Terminals
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 400000
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RAVF Series 0.063W(1/16W) 3.32Ω ±1% 50V Concave Termination Chip Resistor Array
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128800
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Res Thick Film Array 200KΩ 1% 0.25W(1/4W) ±200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Convex SMD T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128800
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Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.25W(1/4W), 10000Ω, 50V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP, ROHS COMPLIANT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128800
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Res Thick Film Array 82KΩ 5% ±200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Concave SMD Paper T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128800
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RACF Series 47 kO ? 0.063 W ?00 SMT Thick Film Chip Resistor Array
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128800
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Res Thick Film Array 3.9KΩ 5% ±200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Concave SMD Paper T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128800
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Res Thick Film Array 27KΩ 5% ±200ppm/℃ ISOL Molded 8Pin 1206(4 X 0603) Concave SMD Paper T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 128800
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Q:What defines the physical structure of the 1206 (3216 Metric) package?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Rectangular body: Standardized dimensions (3.2mm × 1.6mm).
- Thin profile: Typical height of 0.5–0.6mm for space-constrained designs.
- Termination style: Nickel/tin-plated electrodes for solderability. -
Q:Why choose the 1206 package over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than 0805 for higher density.
- Thermal Performance: Efficient heat dissipation via direct PCB thermal coupling.
- Electrical Benefits: Low parasitic inductance (<1nH) for stable high-frequency performance.
- Reliability: Ceramic substrate (for resistors) or molded epoxy (for capacitors) ensures moisture resistance. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.2mm × 1.6mm (3216 Metric).
- Height: 0.55mm (typical).
- Termination Width: 0.8mm (per side).
- Material: Ceramic (resistors) / X7R/X5R dielectric (capacitors).
- Temp Range: -55°C to +125°C (standard). -
Q:Where is the 1206 package typically applied?
A:Dominant use cases:
- Power Electronics: Decoupling capacitors in DC-DC converters (e.g., Murata GRM32 series).
- RF Circuits: Filtering components in 2.4GHz modules (e.g., TDK C3216 series).
- Consumer Electronics: LED drivers and sensor interfaces (e.g., Vishay CRCW1206 resistors). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 1:1 pad-to-component ratio; avoid oversized traces.
- Solder Paste: Type 3 or 4 recommended for fine-pitch printing.
- Reflow Profile: Peak temperature ≤ 250°C (SnAgCu solder).
- Inspection: Optical/AOI for alignment; X-ray (AXI) for void detection in high-reliability apps.



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