100-TQFP
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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Display Driver, LCD 445 Segment, AEC-Q100, Multi-function, 2.7 V to 6 V, SPI Interface, TQFP-100
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 516
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ROHM BU97530KVT-E2 Display Driver, LCD 445 Segment, AEC-Q100, Multi-function, 2.7V to 6V, SPI Interface, TQFP-100
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2
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Power Management Specialized - PMIC 25V Span, 800mA Device Power Supply (DPS)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 996
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Fuse Holder, 32V, 32V, 20A, Automotive Blade Fuse Holder, Wire Leaded, 1
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 806
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TW8824-TA1-CR Low Cost LCD Controller with BT.656 Output (Cu HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 550
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TW8824-TA1-CR Low Cost LCD Controller with BT.656 Output (Cu HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 446
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TW8824AT-TA1-GR Low Cost LCD Controller with BT.656 Output ( HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 780
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TW3811-TC1-CR SLOCTM Receiver Modem PHY IC For Security Surv HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 142
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TW3811-TC1-CR SLOCTM Receiver Modem PHY IC For Security Surv HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15
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TW3801-TC1-CR SLOCTM Camera Modem PHY IC for Security Survei HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 255
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Digital to Analog Converters - DAC DUAL 14Bits DAC 650MSPS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 86
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ARM MCU, DARWIN Family MAX326xx Series Microcontrollers, ARM Cortex-M4F, 32bit, 96 MHz, 2 MB New
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 758
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Q:What defines the physical structure of 100-TQFP?
A:Key features include:
- Leadframe design: Thin quad flat package with gull-wing leads.
- Central thermal pad: 6×6 mm coverage (optional, depending on variant).
- Pin layout: 100-pin configuration with perimeter lead arrangement.
- Profile: 1.0 mm ultra-thin body height. -
Q:Why choose 100-TQFP over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than 100-PLCC.
- Thermal Performance: Exposed pad enables direct PCB heat dissipation.
- Electrical Benefits: Low-inductance leads for high-frequency signals.
- Reliability: Moisture-resistant (MSL3-rated) epoxy substrate. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 14×14 mm.
- Height: 1.0 mm (nominal).
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is 100-TQFP typically applied?
A:Dominant use cases:
- Embedded Systems: Microcontrollers (e.g., STM32F4 series).
- Communications: Ethernet PHY chips (e.g., DP83848).
- Consumer Electronics: Display drivers (e.g., SSD1963). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under exposed pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch leads.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for solder joint validation.



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