Skyworks Solutions, Inc Manufacturer

Skyworks
Full Name : Skyworks Solutions, Inc Manufacturer
Site : www.skyworksinc.com
Country : Unknown

Manufacturer Introduction

Skyworks Solutions, Inc. is an industry leader in radio solutions and precision analog semiconductors servicing a diversified set of mobile communications customers. The company's power amplifiers, front end modules, and direct conversion transceivers are at the heart of many of today's leading-edge multimedia handsets, cellular base stations, and wireless networking platforms. Skyworks also offers a portfolio of highly innovative linear products, supporting a diverse set of automotive, broadband, industrial and medical customers.

Skyworks are empowering the wireless networking revolution, connecting people, places and things around the world. As the demand for ubiquitous, “always-on” connectivity increasingly expands, their innovative, high-performance analog semiconductors are enabling breakthrough communication platforms from global industry leaders – changing the way they live, work, play and learn.

Skyworks' highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.

Through their broad technology expertise and one of the most extensive product portfolios in the industry, they are Connecting Everyone and Everything, All the Time.

Front-end Modules

Always be one step ahead of the game with Skyworks’ innovative and highly integrated front-end modules (FEM) for any of design needs—from ultra-high performance to cost-optimized. Skyworks solutions combine multiple RF functions in one efficient, impactful package.

Switches

Skyworks has the most comprehensive and scalable portfolio in the industry that delivers best-in-class insertion loss, isolation and linearity. Skyworks' switches enable 5G new radio (NR) coverage and low latency Wi-Fi and 5G speeds for a wide range of growing applications ranging from mobile to aerospace and defense, automotive, medical, infrastructure and the internet of things.

Skyworks is product portfolio consists of Discrete semiconductors, RF/IF and RFID, capacitors, integrated circuits (ICs), etc..

Applications

automotive, broadband, industrial and medical customers

Related Technologies More

Resources

AAT2605 five-channel 300mA LDO regulator

Size: 1400 Kb Published Time: 2020-03-11

The AAT2605 is a member of Skyworks' Total Power Management IC (TPMIC™) product family. It contai five fully integrated 300mA low dropout (LDO) regulato in a small Pb-free 14-pin 3mm x 3mm TDFN package, making it ideal for space-cotrained systems. The AAT2605 features low power coumption, low dropout, and high noise immunity from the input power supply. Each channel coumes a mere 30µA of current when enabled, features 250mV of dropout at 250mA and 68dB of power supply rejection at 10kHz. Each channel has its own enable pin and uses a small 1µF output capacitor. Output voltages are factory One Time Programmable (OTP) between 0.6V and 3.7V with 100mV increment and typical regulation accuracy is ±1%. LDO1 and LDO2 share the same input voltage, as do LDO3 and LDO4 while LDO5 has its own independent input.

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SKY77643-11_203324B latest specification

Size: 1240 Kb Published Time: 2020-03-11

Skyworks SKY77643-11 is a hybrid multimode multiband (MMMB) Power Amplifier Module (PAM) that supports 3G / 4G handsets and operates efficiently in WCDMA, TD-SCDMA, and LTE modes. The module is fully programmable through a Mobile Industry Processor Interface (MIPI®). The PAM coists of a WCDMA / LTE block for low, high, and mid-bands, and a MultiFunction Control (MFC) block, RF input/output ports internally matched to 50 Ω to reduce the number of external components. A CMOS integrated circuit uses standard MIPI controls to provide the internal MFC interface and operation. Extremely low leakage current maximizes handset standby time. The InGaP die and the silicon die and passive components are mounted on a multilayer laminate substrate. The assembly is encapsulated in a 4.0 mm x 6.8 mm x 0.8 mm, 42-pad MCM, SMT package which allows for a highly manufacturable, low cost solution.

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