Home > Applications > Energy Metering > Home Energy Gateway Reference Design Based on i.MX283 Processor

Home Energy Gateway Reference Design Based on i.MX283 Processor

Published time : 2016-05-12 NXP,motor control
The NXP(Freescale)Home Energy Gateway (HEG) reference design uses the i.MX283 application processor, ZigBee module MC13224V, 8-bit MCU 9S08QE32, step-down DC/DC MC34726.

Solution Introduction

Today's energy transmission methods require a smarter connection between the public smart grid and users. 

NXP(Freescale) Home Energy Gateway (HEG) can meet this need. As an interface between the smart grid and the consumer home, the Home Energy Gateway connects every smart home and centrally controls energy and energy efficiency.

The Freescale Home Energy Gateway (HEG) reference design uses the i.MX283 application processor, ZigBee module MC13224V, 8-bit MCU 9S08QE32, step-down DC/DC MC34726.

The platform includes an i.MX283 control board that connects to smart meters, home automation systems, broadband IP networks, user interfaces, microgrid power generation units via i.MX283 control, and connectivity extensions for connecting power line modems. GPRS/3G, U-SNAP connected peripherals and large-capacity memory cards.


CORE ADVANTAGES

Based on the low-power ARM9 i.MX283 processor with integrated power management, optimized power consumption by supporting advanced voltage and frequency scaling techniques;
Adopt low power ZigBee module MC13224V;
Full load power consumption 1.5W;

Low cost: The high integration of the i.MX283 processor reduces external components and uses a 4-layer PCB.

Home Energy Gateway Reference Design Framework

Home Energy Gateway Reference Design Framework


The  introduction of i.MX283 

The i.MX283 applications processor offers a low-power, high-performance solution that comes optimized for the general embedded industrial and consumer markets.

Enables applications such as media and smart energy gateways, handheld printers and scanners, and portable medical devices.

Reduces system cost and complexity and provides greater flexibility in system design
Provides extended temperature coverage for harsh environments.
Industrial qualification and product longevity supports the full life of the product in the field.Supported by a comprehensive suite of software and tools.
The i.MX28 processor includes an additional 128-Kbyte on-chip SRAM to make the device ideal for eliminating external RAM in applications with small footprint RTOS.
The i.MX28 supports connections to various types of external memories, such as mobile DDR, DDR2 and LV-DDR2, SLC and MLC NAND Flash.
The i.MX28 can be connected to a variety of external devices such as high-speed USB2.0 OTG, CAN,10/100 Ethernet, and SD/SDIO/MMC.

The Features Of i.MX283
LCD Controller with Touchscreen
NAND support – SLC/MLC and eMMC 4.4 managed
Hardware BCH (up to 20-bit correction)
200 MHz 16-bit DDR2, LV-DDR2, mDDR external memory support
Dual High-speed USB with embedded PHY
8 General purpose 12-bit ADC channels and single 2 Msps ADC channel
Temperature sensor for thermal protection
Multiple connectivity ports (UARTs, SSP, SDIO, SPI, I2C, I2S)
3.3V I/O, 10 year lifetime (Industrial)
Package and Temperature
289 BGA 14x14mm .8mm
-20C to +70C (Consumer)
-40C to +85C (Industrial)

Key Components

No. Part Number Manufacturer
1 MC13224V NXP
2 MCIMX283CVM4BR2 NXP
3 MCIMX283DVM4B NXP
4 MCIMX283CVM4B NXP
5 MC13224VR2 NXP